Semiconductor testing fixture and fabrication method thereof

ABSTRACT

A semiconductor testing fixture is provided. The semiconductor testing fixture comprises a substrate having a surface; a plurality of testing probes formed on the surface of the substrate; and a dielectric layer filling space between adjacent testing probes and covering side surfaces of the plurality of testing probes formed on the surface of the substrate.

CROSS-REFERENCES TO RELATED APPLICATIONS

This application claims the priority of Chinese patent application No. 201410605254.6, filed on Oct. 30, 2014, Chinese patent application No. 201410607154.7, filed on Oct. 30, 2014, Chinese patent application No. 201410606735.9, filed on Oct. 30, 2014, and Chinese patent application No. 201410606075.4, filed on Oct. 30, 2014, the entireties of all of which are incorporated herein by reference.

FIELD OF THE INVENTION

The present invention generally relates to the field of semiconductor testing technology and, more particularly, relates to semiconductor testing fixtures and fabrication processes thereof.

BACKGROUND

A semiconductor testing process is used to test the electrical characteristics and functionalities of packaged IC products after IC packaging processes so as to ensure the functional completeness of the IC products. Further, the testing process also includes categorizing the tested IC products according to their electrical performance. The testing results are used as the evaluation basis for grading the IC products. Finally, the testing process also includes checking the appearance of the IC products. An electrical testing of the IC products is mainly focused on a variety of electrical parameters of the IC products. The electrical testing ensures that the IC products are able to function properly.

The conventional two-point testing method, such as Kelvin testing, etc., often utilizes double parallel top-probes or double parallel gold-fingers. The top-probes and the gold-fingers have a few limitations.

First, the manufacturing accuracy is relatively low. With the continuous shrinking of the critical dimension of semiconductor devices, the size of the tested terminals and/or the distance between different tested terminals are also continuously shrunk. To match such size and distance shrinkage, the limitations of the distribution of the conventional double top-probes and the double gold-fingers become more prominent. Thus, the accuracy requirements has become more and more strict. Sometimes, it is even unable to use the distribution with double top-probes or double gold-fingers.

Second, the structural strength is relatively low. To achieve a two-point testing in the limited space on the tested terminal, the top-probes and the gold-fingers have to be thinner and thinner. Thus, the mechanical strength of the top-probes and the gold fingers is correspondingly lower and lower.

Third, the life span is relatively short. The conventional top-probes and gold-fingers are easily worn. Especially, when the accuracy requirements are relatively high and the mechanical strength is relatively low, the wear may be more severe; and the life span of the testing fixture is reduced.

Fourth, the testing accuracy is relatively low. To adapt to the requirements of the miniaturization of semiconductor devices, the resistance of the top-probes and gold-fingers with the smaller and smaller size is continuously increased. When the top-probes or gold-fingers are used to test a relatively large current, a relatively large voltage drop is generated. The relatively large voltage drop would affect the testing results. Further, it is easy for the parallel-distributed top-probes or gold-fingers to generate a distance difference. The distance difference would also affect the testing results. Further, to reduce the distance between two probes, the conventional double top-probes are usually distributed with inclining faces back-to-back. It is easy for the probes to spin out from the tested terminal because of the torque force of the spring in testing apparatus. Thus, the testing accuracy is affected. The disclosed device structures and methods are directed to solve one or more problems set forth above and other problems.

BRIEF SUMMARY OF THE DISCLOSURE

One aspect of the present disclosure includes a semiconductor testing fixture. The semiconductor testing fixture includes a substrate having a surface; a plurality of testing probes formed on the surface of the substrate; and a dielectric layer filling space between adjacent testing probes and covering side surfaces of the plurality of the testing probes formed on the surface of the substrate.

Another aspect of the present disclosure includes a method for forming a semiconductor testing fixture. The method includes providing a substrate having a surface; forming a plurality of testing probes on the surface of the substrate; and forming a dielectric layer electrically insulating adjacent testing probes on the surface of the substrate.

Another aspect of the present disclosure includes a method for forming a semiconductor testing fixture. The method includes providing a substrate having a surface; forming a dielectric layer on the surface of the substrate; and forming a plurality of testing probes in the dielectric layer.

Other aspects of the present disclosure can be understood by those skilled in the art in light of the description, the claims, and the drawings of the present disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates an exemplary semiconductor testing fixture consistent with the disclosed embodiments;

FIG. 2 illustrates another exemplary semiconductor testing fixture consistent with the disclosed embodiments;

FIGS. 3˜4 illustrate an exemplary testing probe consistent with the disclosed embodiments;

FIG. 5 illustrates an exemplary semiconductor testing fixture used in a testing process consistent with the disclosed embodiments;

FIG. 6 illustrates another exemplary semiconductor testing fixture used in a testing process consistent with the disclosed embodiments;

FIG. 7 illustrates another exemplary semiconductor testing fixtures consistent with the disclosed embodiments;

FIG. 8 illustrates another exemplary semiconductor testing fixtures consistent with the disclosed embodiments;

FIG. 9 illustrates another exemplary semiconductor testing fixture used in a testing process consistent with the disclosed embodiments;

FIGS. 10˜17 illustrate structures corresponding to certain stages of an exemplary fabrication process of a semiconductor testing fixture consistent with the disclosed embodiments;

FIGS. 18˜22 illustrate structures corresponding to certain stages of another exemplary fabrication process of a semiconductor testing fixture consistent with the disclosed embodiments;

FIGS. 23˜25 illustrate structures corresponding to certain stages of another exemplary fabrication process of a semiconductor testing fixture consistent with the disclosed embodiments;

FIGS. 26˜29 illustrate structures corresponding to certain stages of another exemplary fabrication process of a semiconductor testing fixture consistent with the disclosed embodiments;

FIG. 30 illustrates an exemplary fabrication process of a semiconductor testing fixture consistent with the disclosed embodiments;

FIG. 31 illustrates another exemplary fabrication process of a semiconductor testing fixture consistent with the disclosed embodiments;

FIG. 32 illustrates another exemplary fabrication process of a semiconductor testing fixture consistent with the disclosed embodiments; and

FIG. 33 illustrates another exemplary fabrication process of a semiconductor testing fixture consistent with the disclosed embodiments.

DETAILED DESCRIPTION

Reference will now be made in detail to exemplary embodiments of the invention, which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings to refer to the same or like parts.

FIG. 1 illustrates an exemplary semiconductor testing fixture consistent with the disclosed embodiments. As shown in FIG. 1, the semiconductor testing fixture includes a substrate 200, and a plurality of testing probes 20 formed on a surface of the substrate 200.

Further, the semiconductor testing fixture may also include a dielectric layer 210 filling the space between adjacent testing probes 20 formed on the surface of the substrate 200. The dielectric layer 210 may be also be referred as a fixing layer. In one embodiment, the dielectric layer 210 may cover portions of the side surfaces of the testing probes 20. That is, the top surface of the dielectric layer 210 may be lower than the top surfaces of the plurality of testing probes 20. In one embodiment, the thickness of the dielectric layer 210 may be approximately ¼˜⅔ of the height of the testing probes 20.

In certain other embodiments, as shown in FIG. 2, the dielectric layer 210 may cover the entire side surfaces of the plurality of testing probes 20. That is, the top surface of the dielectric layer 210 may level with the top surfaces of the plurality of testing probes 20.

In one embodiment, if the dielectric layer 210 covers the entire side surfaces of the plurality of testing probes 20, a transition board 400 may be formed on the dielectric layer 210. The transition board 400 may include an insulation layer (not labeled) and a plurality of metal blocks 401 formed in insulation layer. The metal blocks 401 may be connected with the plurality of testing probes 20.

The testing probes 20 may be any appropriate structure. In one embodiment, as shown in FIG. 1˜2, the testing probes 20 are coaxial probes. FIGS. 3˜4 illustrate a detailed structure of one of the plurality of the testing probes 20. FIG. 4 is a cross-sectional view of the structure illustrated in FIG. 3 along the AB direction.

As shown in FIGS. 3˜4, each of the first testing probes 20 may include a first testing tip 201, a second testing tip 203, and an insulation layer 202 between the first testing tip 201 and the second testing tip 203. The first testing tip 201 and the second testing tip 203 may be coaxial; and the second testing tip 203 may surround the first testing tip 201.

The first testing tip 201 may include a first tip body (not labeled), one end of the first tip body may be configured as a first testing head 21; and the other end of the first tip body may be configured as a first connecting end 22. The insulation layer 202 may be formed on the side surface of the first tip body.

The second testing tip 203 may include a second tip body (not labeled), one end of the second tip body may be configured as a second testing head 23, and the other end of the second tip body may be configured as a second connecting end 24. The surface of the second testing head 23 may level with the surface of the first testing head 21. When the testing probe 20 is used to perform an electrical testing, the first testing head 21 and the second testing head 23 may contact with the surface of the tested terminal of a packaging structure.

Further, as shown in FIGS. 3˜4, in one embodiment, the first testing tip 201 is a cylinder. Correspondingly, the cross-sectional view of the first testing tip 201 along the AB direction is a circle. The cross-sectional view of the insulation layer 202 is a circular ring. The cross-sectional view of the second testing tip 203 is also a circular ring. In certain other embodiments, the cross-sectional view of the first testing tip 201 may be any other appropriate shape, such as a triangle, or square, etc.

In one embodiment, the testing probes 20 may be formed by a microfabrication process. Thus, the diameter of the first testing tips 201 may be substantially small. In one embodiment, the diameter of the first testing tips 201 may be in a range of approximately 100 nm˜500 μm. For example, the diameter of the first testing tips 201 is in a range of approximately 200 nm˜50 μm.

Correspondingly, the width of the insulation layer 202 and the width of the second testing tips 203 may also be substantially small. In one embodiment, the width of the insulation layer 202 may be in a range of approximately 80 nm˜400 μm. For example, the width of the insulation layer 202 is in a range of approximately 100 nm˜10 μm. The width of the second testing tips 203 may be in a range of approximately 60 nm˜300 μm. For example, the width of the second testing tips 203 is in a range of approximately 90 nm˜25 μm. In certain other embodiments, according to the testing requirements, the diameter of the first testing tips 201, the width of the insulation layer 202, and the width of the second testing tips 203 may be any other appropriate value.

The first testing tips 201 and the second testing tips 203 may be made of any appropriate material, such as Cu, Au, W, or alloy material, etc. The first testing tips 201 and the second testing tips 203 may be made of a same material, or different materials.

The insulation layer 202 may be used to electrically insulate the first testing tips 201 and the second testing tips 203. As shown in FIG. 3, one end surface of insulation layer 202 may level with the first testing head 21 of the first testing tip 201 and the second testing head 23 of the second testing tip 202. The other end surface of the insulation layer 202 may level with the first connecting end 22 of the first testing tip 201 and the second connecting end 24 of the second testing tip 203.

Further, there may be no gap between the first testing head 21 of the first testing tip 201 and the second testing head 23 of the second testing tip 203. Such a structure may prevent the first testing head 21 of the first testing tip 201 and the second testing head 23 of the second testing tip 203 from being deformed during a testing process. If there is a gap between the first testing head 21 of the first testing tip 201 and the second testing head 23 of the second testing tip 203, the first testing head 21 of the first testing tip 201 and the second testing head 23 of the second testing tip 203 may be deformed by external forces during the testing process. The deformation may cause the first testing head 21 of the first testing tip 201 and the second testing head 23 of the second testing tip 203 to be electrically connected. Accordingly, the testing accuracy may be affected.

The insulation layer 202 may be a single layer structure, or a multiple-stacked structure. The insulation layer 202 may be made of an insulation material, such as one or more of silicon oxide, silicon nitride, silicon oxynitride, and silicon carbonitride, etc. The insulation layer 202 may also be made of resin material, such as epoxy, polyimide, polyethylene, benzocyclobutene, or polybenzoxazole, etc.

Further, as shown in FIG. 3, the end of the testing probe 20 having the first testing head 21 and the second testing head 23 may be tapered. That is, along a direction from the second connecting end 24 to the second testing head 23, the width of the portion of the second tip body near the second testing head 23 may be continuously reduced. Such a shape may increase the distance between adjacent testing probes 20 when a plurality of testing probes 20 are used to perform a testing.

The dielectric layer 210 may be made of any appropriate material, such as silicon oxide, silicon nitride, silicon oxynitride, or silicon carbonitride, etc. The dielectric layer 210 may also be made of resin material, such as epoxy, polyimide, polyethylene, benzocyclobutene, or polybenzoxazole, etc.

The dielectric layer 210 may be used to electrically insulate adjacent testing probes 20; and may increase the mechanical strength of the testing probes 20. Further, the dielectric layer 210 may be able to disperse the force caused by the connection between the testing probes 20 and the surfaces of the tested terminals during a testing process; and prevent the testing probes 20 from being deformed, and breaking away from the substrate 200.

The transition board 400 may be used as a transitional structure between the testing probes 20 and the tested terminals during a testing process. Such a transition board 400 may make an electrical testing to be convenient. Further, the transition board 400 may cause the testing probes 20 to indirectly contact with the tested terminals. Thus, it may prevent the damages to the terminals, and/or avoid the deformation of the testing probes 20 caused by a direct contact.

Referring to FIG. 2, the transition board 400 may include an insulation layer (not shown) and a plurality of metal blocks 401 in the insulation layer. The insulation layer may be disposed on the dielectric layer 210. The insulation layer may be used to electrically insulate the metal blocks 401; and fix the corresponding metal blocks 410. The bottom surfaces of the metal blocks 401 may contact with the top surfaces of the testing probes 20; and the top surfaces of the metal blocks may contact with the surfaces of the tested terminals during a testing process.

In one embodiment, the testing probe 20 may be used to test a resistance or a relatively large current. One end of the testing probe 20 may contact with a tested terminal. That is, the first testing head 21 of the first testing tip 201 and the second testing head 23 of the second testing tip 203 may contact with the surface of the tested terminal. Then, a testing voltage may be applied between the first testing tip 201 and the second testing tip 203; and the current passing through the first testing tip 201, the second testing tip 203 and the tested terminal may be measured. According to the applied voltage and the measured current, the resistance may be obtained.

When the testing probe 20 is used to perform a resistance testing, because the first testing tip 201 and the second testing tip 203 may be coaxial, the current passing through the first testing tip 201 may be distributed radially, and flow to the second testing tip 203. That is, the current flowing through the circular region (the region contacts with the end surface of the insulation layer 202) of the tested terminal may be uniform. Thus, the testing accuracy may be improved.

In certain other embodiments, the plurality of testing probes 20 may be used to perform other type of electrical testing. That is, the semiconductor testing fixture having a plurality of testing probes 20 may be used to perform an electrical testing. The testing current may flow from the first testing tip 201 or the second testing tip 203 of one testing probe 20 to the first testing tip 201 or the second testing tip 203 of anther testing probe 20. Alternatively, the testing current may flow from the first testing tip 201 and the second testing tip 203 of one testing probe 20 to the first testing tip 201 and the second testing tip 203 of another testing probe 20.

The number of the plurality of testing probes 20 on the substrate 200 may be equal to, or greater than two. In one embodiment, the plurality of the testing probes 20 may be distributed on the substrate 200 as an array with a predetermined number of rows and a predetermined number of columns.

A signal transmitting circuit (not shown) may be formed in the substrate 200. The signal transmitting circuit may include a plurality of first input terminals, a plurality of second input terminals, a plurality of first output terminals and a plurality of second output terminals, etc. For each testing probe 20, the first output terminal may be electrically connected with the first connecting end 22 of the first testing tip 201; and the second output terminal may be electrically connected with the second connecting end 24 of the second testing tip 203. The first input terminals and the second input terminals may be electrically connected with an external testing circuit. The external testing circuit may be used to provide testing signals. The signal transmitting circuit may be used to transmit the testing signals provided by the external testing circuit to the first testing tips 201 and the second testing tips 203; and transmit the electrical signals obtained from the testing process back to the external testing circuit. The external testing circuit may process the received electrical signals; and the tested parameters may be obtained.

The substrate 200 may be made of the any appropriate material. In one embodiment, the substrate 200 is made of PCB resin.

Further, first metal lines (not labeled) and second metal lines (not labeled) may be formed in the substrate 200. The first input terminals and the first output terminals may be electrically connected through the first metal lines. The second input terminals and the second output terminals may be electrically connected through the second metal lines.

In one embodiment, the substrate 200 may have a front surface and a facing back surface. The back surface of the substrate 200 may include interface regions (not labeled). The plurality of first output terminals and the plurality of second output terminals may be disposed on the front surface of the substrate 200; and may be corresponding to the positions of the first testing tips 201 and the second testing tips 203. The plurality of first input terminals and the plurality of second input terminals may be integrated in the interface regions on the back surface of the substrate 200. Thus, the plurality of first input terminals and the plurality of second input terminals may be connected with an external testing circuit through one or more interfaces; and the interface circuit between the testing fixture and the external testing circuit may be simplified.

In one embodiment, the substrate 200 may be formed by compressing a plurality of PCB boards (not labeled). Each PCB board may include a plurality of interconnect structures (not shown). Each interconnect structure may include a plurality of through-board structures and metal layers formed on the surface of the PCB board and electrically connecting with through-board structures. When the plurality of PCB boards are compressed to form the substrate 200, the plurality of interconnect structures may form the first metal lines and the second metal lines. Thus, the plurality of first input terminals and the plurality of second input terminals may be integrated in the interface regions on the back face of the substrate 200.

In certain other embodiments, the substrate 200 may have a front surface and a facing back surface. The back surface of the substrate 200 may include interface regions. The plurality of first output terminals and the plurality of second output terminals may be disposed on the front surface of the substrate 200. A plurality of first through-board interconnect structures and a plurality of second through-board interconnect structures penetrating through the substrate 200 may be formed in the substrate 200. The first input terminals and the first output terminals may be electrically connected through the first through-board interconnect structures; and the second input terminals and the second output terminals may be electrically connected through the second through-board interconnect structures.

Further, a plurality of first redistribution metal layers and a plurality of second redistribution layers may be formed on the back surface of the substrate 200. One end of the first redistribution metal layers may be electrically connected with the first input terminals; and the other end of the first redistribution metal layers may be disposed in the interface region. One end of the second redistribution metal layers may be electrically connected with the second terminals; and the other end of the second redistribution metal layers may be disposed in the interface region. The first redistribution metal layers and the second redistribution layers may be electrically connected with the external testing circuit through one or more interfaces.

In certain other embodiments, a testing circuit (not shown) may be formed in the substrate 200. The testing circuit may include a plurality of first signal terminals and a plurality of second signal terminals. The first signal terminals may be electrically connected with the first connecting ends 22 of the first testing tip 201. The second signal terminals may be electrically connected with the second connecting ends 24 of the second testing tips 203. When the semiconductor testing fixture is used to perform a test, testing signals, such as voltage signals or current signals, etc., may be applied onto the first testing tip 201s and the second testing tips 203; and received signals, such as current signals, etc., may be processed to obtain the tested parameters, such as resistance, etc.

FIG. 5 illustrates a structure corresponding to an electrical testing utilizing the semiconductor testing fixture illustrated in FIG. 1. As show in FIG. 5, at the beginning of the testing process, the semiconductor testing fixture is installed in a testing apparatus (not shown); and then a tested packaging structure 300 may be disposed on the semiconductor testing fixture. The tested packaging structure 300 may include a plurality of tested terminals 31. The tested terminals 31 may be contacting pads or soldering pads, etc. Portions of the surfaces of the tested terminals 31 may be electrically connected with the testing heads (not labeled) of the testing probes 30, including the first testing heads of the first testing tips 201, and the second testing heads of the second testing tips 203. Then, testing signals may be applied between the first testing tips 201 and the second testing tips 203 to perform the electrical testing.

In certain other embodiments, as shown in FIG. 6, the tested terminals 301 may be soldering balls 301. The semiconductor testing fixture illustrated in FIG. 2 may be used to test such a packaging structure. Portions of the surfaces of the soldering balls 301 may be connected with the surfaces of the metal blocks 401; and then testing signals may applied between the first testing tips 201 and the second testing tips 203 to perform the testing process.

The semiconductor testing fixture may be able to perform an electrical testing on a plurality of tested terminals of the packaging structure simultaneously. Thus, the testing efficiency and the testing accuracy may be improved. Further, the semiconductor testing fixture may be applied to a manual testing, i.e., manually install the tested packaging structure; or an automatic testing, i.e., install the tested packaging structure by robots.

FIG. 7 illustrates another exemplary semiconductor testing fixtures consistent with the disclosed embodiments. As shown in FIG. 7, the semiconductor testing fixture includes a substrate 100, and a plurality of testing probes 101 formed on one surface of the substrate 100.

Further, the semiconductor testing fixture may also include a dielectric layer 102 filling the space between adjacent testing probes 101 formed on the surface of the substrate 100. The dielectric layer 102 may be also be referred as a fixing layer. In one embodiment, the dielectric layer 102 may cover portions of the side surfaces of the testing probes 101. That is, the top surface of the dielectric layer 102 may be lower than the top surfaces of the plurality of testing probes 101. In one embodiment, the thickness of the dielectric layer 102 may be approximately ¼˜⅔ of the height of the testing probes 101.

In certain other embodiments, as shown in FIG. 8, the dielectric layer 102 may cover the entire side surfaces of the plurality of testing probes 101. That is, the top surface of the dielectric layer 102 may level with the top surfaces of the plurality of testing probes 101.

In one embodiment, if the dielectric layer 102 covers the entire side surfaces of the plurality of testing probes 101, as shown in FIG. 8, a transition board 400 may be formed on the dielectric layer 102. The transition board 400 may include an insulation layer (not labeled) and a plurality of metal blocks 401 formed in insulation layer. The metal blocks 401 may be connected with the plurality of testing probes 101.

The testing probes 101 may be any appropriate structure. In one embodiment, as shown in FIGS. 7˜8, the testing probes 101 are single metal tips.

In one embodiment, the cross-sectional view of the testing probe 101 along a direction parallel to the surface of the substrate 200 is a circle. The diameter of the testing probes 101 may be in a range of approximately 100 nm˜300 μm. In certain other embodiments, the cross-sectional view of the testing probe 101 may be any other appropriate shape, such as a triangle, or square, etc.

The testing probes 101 may be made of any appropriate material, such as Cu, Au, W, or alloy material, etc. The number of the plurality of testing probes 101 may be equal to, or greater than two. In one embodiment, the plurality of the testing probes 101 may be distributed on the substrate 100 as an array with a predetermined number of rows and a predetermined number of columns.

The dielectric layer 102 may be made of any appropriate material, such as silicon oxide, silicon nitride, silicon oxynitride, or silicon carbonitride, etc. The dielectric layer 102 may also be made of resin material, such as epoxy, polyimide, polyethylene, benzocyclobutene, or polybenzoxazole, etc.

The dielectric layer 102 may be used to electrically insulate adjacent testing probes 101; and may increase the mechanical strength of the testing probes 101. Further, the dielectric layer 102 may be able to disperse the force caused by the connection between the testing probes 101 and the surfaces of the tested terminals during a testing process; and prevent the testing probes 101 from being deformed; and/or breaking away from the substrate 100.

The transition board 400 may be used as a transition structure between the testing probes 101 and the tested terminals during a testing process. Such a transition board 400 may make an electrical testing to be convenient. Further, the transition board 400 may cause the testing probes 101 to indirectly contact with the tested terminals. Thus, it may prevent the damages to the tested terminals, and/or avoid the deformation of the testing probes 101 caused by a direct contact.

Referring to FIG. 8, the transition board 400 may include the insulation layer (not labeled) and a plurality of metal blocks 401 in the insulation layer. The insulation layer may be disposed on the dielectric layer 102. The insulation layer may be used to electrically insulate the metal blocks 401; and fix the corresponding metal blocks 410. The bottom surfaces of the metal blocks 401 may contact with the top surfaces of the testing probes 20; and the top surfaces of the metal blocks 401 may contact with the surfaces of the tested terminals.

A signal transmitting circuit (not shown) may be formed in the substrate 100. The signal transmitting circuit may include a plurality of input terminals and a plurality of output terminals. The output terminals may be electrically connected with the bottoms of the testing probes 101; and the input terminals may be electrically connected with an external testing circuit. The external testing circuit may be used to provide testing signals. The signal transmitting circuit may be used to transmit the testing signals provided by the external testing circuit to the testing probes 101; and transmit the electrical signals obtained from the testing process back to the external testing circuit. The external testing circuit may process the received electrical signals; and the tested parameters may be obtained.

The substrate 100 may be made of the any appropriate material. In one embodiment, the substrate 100 is made of PCB resin.

In one embodiment, the substrate 100 may have a front surface and a facing back surface. The back surface of the substrate 100 may include interface regions. The plurality of output terminals may be disposed on the front surface of the substrate 200; and may be corresponding to the positions of the bottom surfaces of the testing probes 101. The plurality of input terminals may be integrated in the interface regions on the back surface of the substrate 100. Thus, the plurality of input terminals may be connected with the external testing circuit through one or more interfaces; and the interface circuit between the semiconductor testing fixture and the external testing circuit may be simplified.

In one embodiment, the substrate 100 may be formed by compressing a plurality of PCB boards. Each PCB board may include a plurality of interconnect structures. Each interconnect structure may include a plurality of through-board structures and metal layers formed on the surface of the PCB board and electrically connecting with the through-board structures. When the plurality of PCB boards are compressed to form the substrate 100, the plurality of interconnect structures may form a plurality of metal lines. The metal lines may be bent. Thus, the plurality of input terminals may be integrated in the interface regions on the back face of the substrate 100.

In certain other embodiments, the substrate 100 may have a front surface and a facing back surface. The back surface of the substrate 100 may include interface regions. The plurality of output terminals may be disposed on the front surface of the substrate 100. A plurality of through-board interconnect structures penetrating through the substrate 100 may be formed in the substrate 100. The plurality of input terminals and the plurality of output terminals may be electrically connected through the through-board interconnect structures.

Further, a plurality of redistribution metal layers may be formed on the back surface of the substrate 100. One end of the redistribution metal layers may be electrically connected with the input terminals; and the other end of the redistribution metal layers may be disposed in the interface regions. The redistribution metal layers may be electrically connected with the external testing circuit through one or more interfaces.

In certain other embodiments, a testing circuit (not shown) may be formed in the substrate 100. The testing circuit may include a plurality of signal terminals. The signals terminal may be electrically connected with the bottom surfaces of the testing probes 101. When the semiconductor testing fixture is used to perform a test, testing signals, such as voltage signals or current signals, etc., may be applied onto the testing probes 101; and received signals, such as current signals, etc., may be processed to obtain the testing parameters, such as resistance, etc.

FIG. 9 illustrates a structure corresponding to an electrical testing utilizing the semiconductor testing fixture illustrated in FIG. 8. As show in FIG. 9, at the beginning of the testing process, the semiconductor testing fixture is installed in a testing apparatus (not shown); and then a tested packaging structure 300 may be disposed on the semiconductor testing fixture. The tested packaging structure 300 may include a plurality of tested terminals 301. In one embodiment, the tested terminals 301 are soldering balls 301. Portions of the surfaces of the soldering balls 301 may be electrically connected with the metal blocks 401. Then, testing signals may be applied the testing probes 101 to perform the electrical testing.

The semiconductor testing fixture may be able to perform an electrical testing on a plurality of tested terminals of a packaging structure simultaneously. Thus, the testing efficiency and the testing accuracy may be improved. Further, the semiconductor testing fixture may be applied to a manual testing, i.e., manually install the tested packaging structure; or an automatic testing, i.e., install the tested packaging structure by robots.

FIG. 30 illustrates an exemplary fabrication process of a semiconductor testing fixture consistent with the disclosed embodiments. FIGS. 10˜17 illustrate structures corresponding certain stages of the exemplary fabrication process.

As show in FIG. 30, at the beginning of the fabrication process, a substrate with certain structures is provided (S101). FIG. 10 illustrates a corresponding structure.

As shown in FIG. 10, a substrate 200 in provided; and a plurality of first testing tips 201 are formed on a surface of the substrate 200. The number of the plurality of first testing tips 201 may be equal to, or greater than two.

In one embodiment, the first testing tip 201 is a cylinder. Correspondingly, the cross-sectional view of the first testing tip 201 along a direction parallel to the surface of the substrate 200 is a circle. In certain other embodiments, the cross-sectional view of the first testing tip 201 may be any other appropriate shape, such as a triangle, or square, etc. The diameter of the first testing tips 201 may be in a range of approximately 100 nm˜500 μm.

One end of the first testing tip 201 connecting with the surface of the substrate 200 may be referred as a first connecting end. The other end (the end facing the first connecting end) of the first testing tip 201 may be referred as a first testing head.

In embodiment, a signal-transmitting circuit (not shown) may be formed in the substrate 200. The signal transmitting circuit may include a plurality of first input terminals, a plurality of second input terminals, a plurality of first output terminals, and a plurality of second output terminals, etc. The first output terminals may be electrically connected with the first connecting ends (not labeled) of the first testing tips 201; and the second output terminals may be electrically connected with the second connecting ends of subsequently formed second testing tips. The first input terminals and the second input terminals may be electrically connected with an external testing circuit. The external testing circuit may be used to provide testing signals. The signal transmitting circuit may be used to transmit the testing signals provided by the external testing circuit to the first testing tips 201 and the subsequently formed second testing tips; and transmit the electrical signals obtained from a testing process back to the external testing circuit. The external testing circuit may process the received electrical signals; and the tested parameters may be obtained.

Further, the substrate 200 may be made of PCB resin. First metal lines (not labeled) and second metal lines (not labeled) may be formed in the substrate 200. The first input terminals and the first output terminals may be electrically connected through the first metal lines formed in the substrate 200. The second input terminals and the second output terminals may be electrically connected through the second metal lines formed in the substrate 200.

In one embodiment, the substrate 200 may have a front surface and a facing back surface. The back surface of the substrate 200 may include interface regions. The plurality of first output terminals and the plurality of second output terminals may be disposed on the front surface of the substrate 200; and may be corresponding to the positions of the first testing tips 201 and the subsequently formed second testing tips. The plurality of first input terminals and the plurality of second input terminals may be integrated in the interface regions on the back surface of the substrate 200. Thus, the plurality of first input terminals and the plurality of second input terminals may be connected with the external testing circuit through one or more interfaces; and the interface circuit between the semiconductor testing fixture and the external testing circuit may be simplified.

In one embodiment, the substrate 200 may be formed by compressing a plurality of PCB boards. Each PCB board may include a plurality of interconnect structures. Each interconnect structure may include a plurality of through-board structures and metal layers formed on the surface of the PCB board and electrically connecting with through-board structures. When the plurality of PCB boards are compressed to form the substrate 200, the plurality of interconnect structures may form the first metal lines and the second metal lines. Thus, the plurality of first input terminals and the plurality of second input terminals may be integrated in the interface regions on the back face of the substrate 200.

In certain other embodiments, the substrate 200 may have a front surface and a facing back surface. The back surface of the substrate 200 may include interface regions. The plurality of first output terminals and the plurality of second output terminals may be disposed on the front surface of the substrate 200. A plurality of first through-board interconnect structures and a plurality of second through-board interconnect structures penetrating through the substrate 200 may be formed in the substrate 200. The first input terminals and the first output terminals may be electrically connected through the first through-board interconnect structures; and the second input terminals and the second output terminals may be electrically connected through the second through-board interconnect structures.

Further, a plurality of first redistribution metal layers and a plurality of second redistribution layers may be formed on the back surface of the substrate 200. One end of the first redistribution metal layers may be electrically connected with the first input terminals; and the other end of the first redistribution metal layers may be disposed in the interface regions. One end of the second redistribution metal layers may be electrically connected with the second terminals; and the other end of the second redistribution metal layers may be disposed in the interface regions. The first redistribution metal layers and the second redistribution layers may be electrically connected with the external testing circuit through one or more interfaces.

In certain other embodiments, a testing circuit (not shown) may be formed in the substrate 200. The testing circuit may include a plurality of first signal terminals and a plurality of second signal terminals. The first signal terminals may be electrically connected with the first connecting ends of the first testing tips 201. The second signal terminals may be electrically connected with the second connecting ends of the subsequently formed second testing tips. When the testing circuit is used to perform a test, testing signals, such as voltage signals or current signals, etc., may be applied onto the first testing tips 201 and the subsequent formed second testing tips; and received signals, such as current signals, etc., may be processed to obtain the testing parameters, such as resistance, etc.

In one embodiment, the substrate 200 may include a semiconductor substrate and a dielectric layer formed on the semiconductor substrate. The semiconductor substrate may be a silicon substrate, or a germanium substrate, etc. Semiconductor devices, such as transistors, etc., may be formed on the semiconductor substrate; and metal interconnect lines and passive devices, such as resistors and capacitors, etc., may be formed in the dielectric layer. The metal interconnect lines may electrically connect the semiconductor devices and the passive devices to form the testing circuit. The first signal terminals and the second signal terminals may be led out by the first metal lines and the second metal lines that are electrically connected with the testing circuit in the dielectric layer.

In one embodiment, a process for forming the first testing tip 201 may include forming a sacrificial layer (not shown) having a plurality of through-holes exposing the surface of the substrate 200 on the substrate 200; filling the plurality of through-holes with a first metal layer to form the plurality of first testing tips 201; and removing the sacrificial layer. Thus, the plurality of first testing tips 201 may be formed.

The first metal layer may be formed by any appropriate process, such as a chemical vapor deposition (CVD) process, a physical vapor deposition (PVD) process, a flowable CVD (FCVD) process, or an electroplating process. In one embodiment, the first metal layer is formed by an electroplating process. Before the electroplating process, a conductive layer may be formed on the side and bottom surfaces of the through-holes. The conductive layer may be used as a cathode for the electroplating process.

The conductive layer may be a single layer structure, or a multiple-layer structure. The conductive layer may be made of one or more of Ti, Ta, TiN, and TaN, etc.

In one embodiment, the conductive layer is a double-layer structure. The double-layer structure may be a structure having a Ti layer and a TiN layer formed on the Ti layer, or a structure having a Ta layer and a TaN layer formed on the Ta layer.

The thickness of the conductive layer may be smaller than the diameter of the through-holes. In one embodiment, the thickness of the conductive layer may be in a range of approximately 50 nm˜200 nm.

Various processes may be used to form the conductive layer. In one embodiment, the conductive layer is formed by a sputtering process.

After forming the conductive layer, an electroplating process may be performed to form the first metal layer. The first metal layer may be formed on the conductive layer; and may fill the through-holes. After the electroplating process, a chemical mechanical polishing (CMP) process may be performed to remove portions of the first metal layer and the conductive layer on the surface of the sacrificial layer. Thus, the first testing tips 201 may be formed. Therefore, the first testing tips may include a portion of the first metal layer and a portion of the conductive layer covering the portion of the first metal layer. The portion of the conductive layer may be used as a diffusion barrier layer to prevent the metal of the first metal layer from diffusing into the subsequently formed insulation layer. The first metal layer may be made of any appropriate material, such as Cu, Au, W, or metal alloy, etc.

In certain other embodiments, a process for forming the plurality of the first testing tips 201 may include forming a first metal layer (not labeled) on the substrate 200; forming a patterned mask layer (not shown) on the first metal layer; etching the first metal layer using the patterned mask layer as an etching mask to form the plurality of first testing tips 201; and removing the patterned mask layer. Thus, the plurality of first testing tips 201 may be formed on the substrate 200.

Returning to FIG. 30, after forming the plurality of first testing tips 201, an insulation layer may be formed (S102). FIGS. 11˜12 illustrate corresponding structures.

As shown in FIG. 12, an insulation layer 202 is formed on a side surface of each of the plurality of first testing tips 201. The insulation layer 202 may be a single layer structure or a multiple-layer structure. The insulation layer 202 may be made of any appropriate material, such as one or more of silicon oxide, silico nitride, silicon oxynitride, and silicon carbonitride, etc. The thickness of the insulation layer 207 may be in a range of approximately 80 nm˜400 μm.

A process for forming the insulation layer 202 may include forming an insulation film 204 on the side surfaces of the first testing tips 201 and the surface of the substrate 200 (as shown in FIG. 11). That is, the insulation film 204 may cover the entire first testing tips 201. The process may also include performing a mask-less etching process (etch-back) process on the insulation film 204. Thus, the insulation layer 204 may be formed on the side surface of each of the plurality of first testing tips 201 (as shown in FIG. 12).

In one embodiment, the insulation layer 202 is made of silicon oxide. The insulation film 204 may be formed by any appropriate process, such as a CVD process, a PVD process, or an FCVD process, etc.

In certain other embodiments, the insulation layer 202 may be made of resin material. The resin material may include epoxy, polyimide, polyethylene, benzocyclobutene, or polybenzoxazole, etc. The insulation film 204 may be formed by a screen-printing process, etc.

The mask-less etching process may be any appropriate process. In one embodiment, the mask-less etching process is an anisotropic plasma etching process. In one embodiment, the etching gas of the anisotropic plasma etching process may include fluoride and carbon-containing gas, etc. Specifically, the etching gas may include one or more CF₄, C₂F₆, C₄F₈, CHF₃, and CH₂F₂, etc. The source power of the plasma may be in a range of approximately 500 W˜1000 W. The bias power of the plasma may be in a range of 0˜100 W. The pressure of the etching chamber may be in a range of approximately 2 mTorr˜500 mTorr.

Returning to FIG. 30, after forming the insulation layer 202, a plurality of second testing tips may be formed (S103). FIGS. 13˜14 illustrate corresponding structures.

As shown in FIG. 14, a second testing tip 203 is formed on the insulation layer 202 around each of the first testing tips 201. The second testing tips 203 may surround the first testing tips 201. Further, the second testing tips 203 may be coaxial with the first testing tips 201. One end of the second testing tip 203 connecting with the surface of the substrate 200 may be referred as a second connecting end; and the other end (facing the second connecting end) of the second testing tip 203 may be referred as a second testing head. The second testing head of the second testing tip 203 may be level with the first testing head of the first testing tip 201. The second testing heads and the first testing heads may be connected with the surface of the tested terminals during a testing process.

A process for forming the second testing tips 203 may include forming a second metal layer 205 covering the top surfaces of the insulation layer 202 and the first testing tips 201, the side surface of the insulation layer 202 and the surface of the substrate 200 (as shown in FIG. 13); and performing a mask-less etching process to remove portions of the second metal layer 205 on the top surfaces of the insulation layer 202 and the first testing tips 201 and the surface of the substrate 200. Thus, as shown in FIG. 14, the plurality of second testing tips 203 may be formed.

Each of the first testing tips 201 and the corresponding insulation layer 202 and the corresponding second testing tip 203 may form a testing probe 20. Thus, a plurality of testing probes 20 may be formed on the substrate 200.

The second metal layer 205 may be made of any appropriate material, such as Cu, Au, W, or metal alloy, etc. The thickness of the second metal layer 205 may be in a range of approximately 60 nm˜300 μm.

Various processes may be used to form the second metal layer 205, such as a CVD process, a PVD process, an FCVD process, an electroplating process, or a sputtering process, etc. In one embodiment, the second metal layer 205 is formed by a sputtering process.

The mask-less etching process may be any appropriate process. In one embodiment, the mask-less etching process is an anisotropic plasma etching process. The etching gas of the plasma etching process may include one or more of SF₆, NF₃, Cl₂, and HBr, etc. The source power of the plasma may be in a range of approximately 500 W˜1500 W. The bias power of the plasma may be in a range of approximately 0˜100 W. The pressure of the etching chamber may be in a range of approximately 10 mTorr˜500 mTorr.

Returning to FIG. 30, after forming the send testing tips 203, a dielectric layer may be formed on the surface of the substrate 200 (S104). FIG. 15 illustrates a corresponding structure.

As shown in FIG. 15, a dielectric layer 210 is formed on the substrate 200. The dielectric layer 210 may be fill the space between adjacent testing probes 20. The dielectric layer 210 may be used as a fixing layer to increase the mechanical strength of the testing probes 20; and an insulation layer to electrically insulate the adjacent testing probes 20.

In one embodiment, the dielectric layer 210 may cover the entire side surfaces of the testing probes 20. That is, the top surface of the dielectric layer 210 may level with the top surfaces of the testing probes 20.

A process for forming the dielectric layer 210 may include forming a dielectric material film covering the surfaces of the testing probes 20 on the surface of the substrate 200; and planarizing the dielectric film using the top surfaces of the testing probes 20 as a polishing stop layer. Thus, the dielectric layer 210 may be formed.

The dielectric layer 210 may be made of any appropriate material, such as silicon oxide, silicon nitride, silicon oxynitride, silicon carbonitride, or resin (epoxy, or polyimide, etc.) etc. In one embodiment, when the dielectric layer 210 is made of one of silicon oxide, silicon nitride, silicon oxynitride, and silicon carbonitride, the dielectric material film may be formed by a CVD process. In certain other embodiments, the dielectric layer 210 may be made of resin material, the dielectric material film may be formed by a wet-coating process, or a screen-printing process.

Optionally, as shown in FIG. 16, after forming the dielectric layer 210, a transition board 400 may be formed on the top surface of the dielectric layer 210 and the tops surfaces of the testing probes 20. The transition board 400 may include an insulation layer (not labeled) formed on the top surface the dielectric layer 210, and a plurality of metal blocks 401 formed on the top surfaces of the testing probes 20.

A process for forming the transition board 400 may include forming the insulation layer having a plurality of openings (not labeled) exposing the top surfaces of the testing probes 20 on the dielectric layer 210; and filling metal material in the openings to form the metal blocks 401 in the openings.

The insulation layer may be made of any appropriate material, such as silicon oxide, silicon nitride, silicon oxynitride, silicon carbonitride, or resin (epoxy, or polyimide, etc.) etc. The insulation layer having the plurality of openings may be formed by forming an insulation material layer; and etching the insulation material layer to expose the top surfaces of the testing probes 20 to form the plurality of openings.

The size of the openings may be greater than the size of the top surfaces of the testing probes 20. Thus, the openings may expose the entire top surfaces of the testing probes 20. Accordingly, the metal blocks 401 formed in the openings may be connected with the entire top surfaces of the testing probes 20.

A process for forming the metal blocks 401 may include forming a metal layer filling the openings on the insulation layer; and performing a CMP process to remove the portion of the metal layer on the surface of the insulation layer. Thus, the metal blocks 401 may be formed.

The metal layer may be made of any appropriate material, such as W, Al, Cu, Ti, Au, Pt, Ni, or metal alloy, etc. The metal layer may be formed by a sputtering process, or an electroplating process, etc.

In certain other embodiments, after forming the dielectric layer 210, the top surface of the dielectric layer 210 may be recessed. Thus, a semiconductor testing fixture illustrated in FIG. 17 may be formed. As shown in FIG. 17, the dielectric layer 210 may cover portions of the side surfaces of the second testing tips 203. That is, the top surface of the dielectric layer 210 may be lower than the top surfaces of the testing probes 20. In one embodiment, the thickness of the dielectric layer 201 may be approximately ¼˜⅔ of the height of the testing probes 20.

The top surface of the dielectric layer 210 may be recessed by any appropriate process, such as an etch-back process using as a dry etching process, a wet etching process, or an ion beam etching process, etc. Before performing the etch-back process, the top surfaces of the plurality of testing probes 20 may be covered by a mask layer. The mask layer may prevent the testing probes 20 from being damaged during the etch-back process.

In certain other embodiments, if the mask layer is omitted, the dielectric layer 210 and the insulation layer 202 may be made different materials; and may have an etching selectivity. When the etch-back is being performed, the etch-back process may not etch the insulation layer 202, or may etch the insulation layer 202 with a substantially low etching rate. Thus, the completeness of the insulation layer 202 may be ensured.

FIG. 31 illustrates another exemplary fabrication process of a semiconductor testing fixture consistent with the disclosed embodiments. FIGS. 18˜22 illustrate structures corresponding certain stages of the exemplary fabrication process.

As shown in FIG. 31, at the beginning of the fabrication process, a substrate with certain structures is provided (201). FIGS. 18˜19 illustrate a corresponding structure. FIG. 19 is a top-view of the structure illustrated in FIG. 18.

As shown in FIGS. 18˜19, a substrate 200 is provided. Further, a dielectric layer 210 is formed on the substrate 200. The dielectric layer 210 may have a plurality of first through-holes 208, and a plurality of ring-shaped through holes 209 surrounding the first through-holes 208. The first through-hole 208 may be insulated from the ring-shaped through-holes 209 by portions of the dielectric layer 210. Further, each of the first though-holes 208 may be coaxial with a surrounding ring-shaped through-hole 209. The number of the first through-holes 208 may be equal to, or greater than two.

The top view of the first through-holes 208 may be circular; and the top view of the ring-shaped through holes 209 may be ring-shaped. In certain other embodiments, the top view of the first through-holes 208 may be any other appropriate shape, such as triangle, rectangle, or square, etc.

The first through-holes 208 may expose the surface of the substrate 200; and may be used for subsequently forming first testing tips. The ring-shaped through-holes 209 may expose the surface of the substrate; and may be used for subsequently forming second testing tips. The subsequently formed first testing tips, the subsequently formed second testing tip and the portions of the dielectric layer 210 insulating the first through-holes 208 and the ring-shaped through-holes 209 may form a plurality of testing probes on the substrate 200. One end of the subsequently formed first testing tip connecting with the surface of the substrate 200 may be referred as a first connecting end; and the other end of the subsequently formed first testing tip may be referred as a first testing head. One end of the subsequently formed second testing tip connecting with the surface of the substrate 200 may be referred as a second connecting end; and the other end of the subsequently formed second testing tip may be referred as a second testing head. The first testing head may level with the second testing head.

In one embodiment, a signal transmitting circuit (not shown) may be formed in the substrate 200. The signal transmitting circuit may include a plurality of first input terminals, a plurality of second input terminals, a plurality of first output terminals and a plurality of second output terminals, etc. The first output terminals may be electrically connected with the first connecting ends of the subsequently formed first testing tips; and the second output terminals may be electrically connected with the second connecting ends of the subsequently formed second testing tips. The first input terminals and the second input terminals may be electrically connected with an external testing circuit. The external testing circuit may be used to provide testing signals. The signal transmitting circuit may be used to transmit the testing signals provided by the external testing circuit to the subsequently formed first testing tips and the subsequently formed second testing tips; and transmit the electrical signals obtained from the testing process back to the external testing circuit. The external testing circuit may process the received electrical signals; and the testing parameters may be obtained.

Further, first metal lines (not labeled) and second metal lines (not labeled) may be formed in the substrate 200. The first input terminals and the first output terminals may be electrically connected through the first metal lines formed in the substrate 200. The second input terminals and the second output terminals may be electrically connected through the second metal lines formed in the substrate 200.

In one embodiment, the substrate 200 may have a front surface and a facing back surface. The back surface of the substrate 200 may include interface regions. The plurality of first output terminals and the plurality of second output terminals may be disposed on the front surface of the substrate 200; and may be corresponding to the positions of the subsequently formed first testing tips and the subsequently formed second testing tips. The plurality of first input terminals and the plurality of second input terminals may be integrated in the interface regions on the back surface of the substrate 200. Thus, the plurality of first input terminals and the plurality of second input terminals may be connected with the external testing circuit through one or more interfaces; and the interface circuit between the semiconductor testing fixture and the external testing circuit may be simplified.

In one embodiment, the substrate 200 may be formed by compressing a plurality of PCB boards. Each PCB board may include a plurality of interconnect structures. Each interconnect structure may include a plurality of through-board structures and metal layers formed on the surface of the PCB board and electrically connecting with through-board structures. When the plurality of PCB boards are compressed to form the substrate 200, the plurality of interconnect structures may form the first metal lines and the second metal lines. Thus, the plurality of first input terminals and the plurality of second input terminals may be integrated in the interface regions on the back face of the substrate 200.

In certain other embodiments, the substrate 200 may have a front surface and a facing back surface. The back surface of the substrate 200 may include interface regions. The plurality of first output terminals and the plurality of second output terminals may be disposed on the front surface of the substrate 200. A plurality of first through-board interconnect structures and a plurality of second through-board interconnect structures penetrating through the substrate 200 may be formed in the substrate 200. The first input terminals and the first output terminals may be electrically connected through the first through-board interconnect structures; and the second input terminals and the second output terminals may be electrically connected through the second through-board interconnect structures.

Further, a plurality of first redistribution metal layers and a plurality of second redistribution layers may be formed on the back surface of the substrate 200. One end of the first redistribution metal layers may be electrically connected with the first input terminals; and the other end of the first redistribution metal layers may be disposed in the interface regions. One end of the second redistribution metal layers may be electrically connected with the second terminals; and the other end of the second redistribution metal layers may be disposed in the interface regions. The first redistribution metal layers and the second redistribution layers may be electrically connected with the external testing circuit through one or more interfaces.

In certain other embodiments, a testing circuit (not shown) may be formed in the substrate 200. The testing circuit may include a plurality of first signal terminals and a plurality of second signal terminals. The first signal terminals may be electrically connected with the first connecting ends of the subsequently formed first testing tips. The second signal terminals may be electrically connected with the second connecting ends of the subsequently formed second testing tips. When the testing circuit is used to perform a test, testing signals, such as voltage signals or current signals, etc., may be applied onto the subsequently formed first testing tips and the subsequent formed second testing tips; and received signals, such as current signals, etc., may be processed to obtain the testing parameters, such as resistance, etc.

The dielectric layer 210 may be made of any appropriate material, such as one or more of silicon oxide, silicon nitride, silicon oxynitride, and silicon carbonitride, etc. Various processes may be used to form the dielectric layer 210, such as a CVD process, a PVD process, or an FCVD process, etc. In one embodiment, the dielectric layer 210 is formed by a CVD process.

After forming a dielectric material layer by a CVD process, a patterned mask layer may be formed on the dielectric material layer. Then, the plurality of first through-holes 208 and the corresponding ring-shaped through-holes 209 may be formed by etching the dielectric material layer using the patterned mask layer as an etching mask to form the dielectric layer 210. After forming the dielectric layer 210 having the plurality of the first through-holes 208 and the plurality of ring-shaped through-holes 209, the patterned mask layer may be removed.

The dielectric material layer may be etched by any appropriate process, such as a dry etching process, a wet etching process, or an ion beam etching process, etc. The patterned mask layer may be removed by any appropriate process, such as a dry etching process, a wet etching process, or a plasma ashing process, etc.

In certain other embodiments, the dielectric layer 210 may be made of resin material. The resin material may include epoxy, polyimide, polyethylene, benzocyclobutene, or polybenzoxazole, etc. The dielectric layer 210 made of resin material may be formed by a dry-coating process, a wet-coating process, a screen-printing process, or a roll-coating process, etc.

After forming a dielectric film made of the resin material on the substrate 200, an exposure process and a developing process may be performed to form the plurality of first through-holes 208 and the corresponding ring-shaped through-holes 209. Thus, the dielectric layer 210 made of the resin material may be formed. By using such a process, the fabrication process of the dielectric layer 210 may be simplified.

Returning to FIG. 31, after forming the dielectric layer 210, a plurality of first testing tips and a plurality of second tips may be formed (S202). FIG. 20 illustrates a corresponding structure.

As shown in FIG. 20, a first testing tip 201 is formed in each of the plurality of first through-holes 208; and a second testing tip 203 is formed in each of the plurality of ring-shaped through-holes 209. The first testing tips 201 and the second testing tips 203 may be formed by a same step. In certain other embodiments the first testing tips 201 and the second testing tips 203 may be formed by separated steps.

The first testing tips 201 and the second testing tips 203 may be formed by any appropriate process, such as a CVD process, a PVD process, an FCVD process, a sputtering process, or an electroplating process, etc. In one embodiment, the first testing tips 201 and the second testing tips 203 is formed by an electroplating process.

Before forming the first testing tips 201 and the second testing tips 203 by an electroplating process, a conductive layer (not shown) may be formed on the side surfaces and bottoms of the first through-holes 208 and the ring-shaped through-holes 209 and the surface of the dielectric layer 210. The conductive layer may be used as a cathode for the electroplating process.

The conductive layer may be a single layer structure, or a multiple-layer structure. The conductive layer may be made of any appropriate material, such as one or more of Ti, Ta, TiN, and TiN, etc. In one embodiment, the conducive layer is a double-layer structure. The double-layer structure may be a structure having a Ti layer and a TiN layer formed on the Ti layer, or a structure having a Ta layer and a TaN layer formed on the Ta layer.

Various processes may be used to form the conductive layer, such as a CVD process, a PVD process, or an FCVD process, etc. In one embodiment, the conductive layer is formed by a sputtering process.

The thickness of the conductive layer may be smaller than the smallest radius of one of the radius of the first through-holes 208 and the radius of the ring-shaped through-holes 209.

After forming the conductive layer, the electroplating process may be formed to form a metal layer. The metal layer may be on the conductive layer; and may fill the first through-holes 208 and the ring-shaped through-holes 209. After the electroplating process, a CMP process may be performed to remove portions of the conductive layer and the metal layer on the surface of the dielectric layer 210. Thus, the first testing tips 201 and the second testing tips 203 may be formed. The first testing tips 201 and the second testing tips 203 may all include portions of the conductive layer and the portions of the metal layer covered by the portions of the conductive layer. The portions of the conductive layer may be used as a diffusion barrier layer to prevent the metal in the metal layer from diffusing into the dielectric layer 210. The metal layer may be made of any appropriate material, such as Cu, Au, W, or metal alloy, etc.

In one embodiment, the first testing tips 201 and the second testing tips 203 may be formed by the electroplating process simultaneously. Thus, the first testing tips 201 and the second testing tips 203 may not be damaged by etching processes. Therefore, the morphology of the first testing tips 201 and the second testing tips 203 may be as desired.

Optionally and additionally, in one embodiment, after forming the first testing tips 201 and the second testing tips 203, a transition board 400 may be formed on the top surface of the dielectric layer 210 and the top surfaces of the testing probes 20. FIG. 21 illustrates a corresponding structure.

As shown in FIG. 21, the transition board 400 may include an insulation layer (not labeled) formed on the top surface the dielectric layer 210, and a plurality of metal blocks 401 formed on the top surfaces of the testing probes 20.

A process for forming the transition board 400 may include forming the insulation layer having a plurality of openings (not labeled) exposing the top surfaces of the testing probes 20 on the dielectric layer 210; and filling metal material in the openings to form the metal blocks 401 in the openings.

The insulation layer may be made of any appropriate material, such as silicon oxide, silicon nitride, silicon oxynitride, silicon carbonitride, or resin (epoxy, or polyimide, etc.) etc. The insulation layer having the plurality of openings may be formed forming an insulation material layer; and etching the insulation material layer to expose the testing probes 20 to form the plurality of openings.

The size of the openings may be greater than the size of the top surfaces of the testing probes 20. Thus, the openings may expose the entire top surfaces of the testing probes 20. Accordingly, the metal blocks 401 formed in the openings may connect the entire top surfaces of the testing probes 20.

A process for forming the metal blocks 401 may include forming a metal layer filling the openings on the insulation layer; and performing a CMP process to remove the portion of the metal layer on the surface of the insulation layer. Thus, the metal blocks 401 may be formed.

The metal layer may be made of any appropriate material, such as W, Al, Cu, Ti, Au, Pt, Ni, or metal alloy, etc. The metal layer may be formed by a sputtering process, or an electroplating process, etc.

In certain other embodiments, after forming the first testing tips 201 and the second testing tips 203, the top surface of the dielectric layer 210 may be recessed. Thus, a semiconductor testing fixture illustrated in FIG. 22 may be formed.

As shown in FIG. 22, the dielectric layer 210 may cover portions of the side surfaces of the second testing tips 203. That is, the top surface of the dielectric layer 201 may be lower than the top surfaces of the testing probes 20. In one embodiment, the thickness of the dielectric layer 201 may be approximately ¼˜⅔ of the height of the testing probes 20.

The top surface of the dielectric layer 210 may be recessed by any appropriate process, such as an etch-back process using as a dry etching process, a wet etching process, or an ion beam etching process, etc. Before performing the etch-back process, the top surfaces of the plurality of testing probes 20 may be covered by a mask layer. The mask layer may prevent the testing probes 20 from being damaged during the etch-back process.

In certain other embodiments, if the mask layer is omitted, the dielectric layer 210 and the insulation layer 202 may be made different material; and may have an etching selectivity. When the etch-back is being performed, the etch-back process may not etch the insulation layer 202, or may etch the insulation layer 202 with a substantially low etching rate. Thus, the completeness of the insulation layer 202 may be ensured.

FIG. 32 illustrates another exemplary fabrication process of a semiconductor testing fixture consistent with the disclosed embodiments. FIGS. 23˜25 illustrate structures corresponding certain stages of the exemplary fabrication process.

As shown in FIG. 32, at the beginning of the fabrication process, a substrate with certain structures is provided (S301). FIG. 23 illustrates a corresponding structure.

As shown in FIG. 23, a substrate 100 is provided; and a plurality of testing probes 101 may be formed on a surface the substrate 100. The testing probes 101 may be any appropriate structure. In one embodiment, the testing probes 101 are single metal tips. The number of the testing probes 101 may be equal to, or greater than two.

In one embodiment, the cross-sectional view of the testing probe 101 along a direction parallel to the surface of the substrate 100 is a circle. The diameter of the testing probes 101 may be in a range of approximately 100 nm˜300 μm. In certain other embodiments, the cross-sectional view of the testing probes 101 may be any other appropriate shape, such as a triangle, or square, etc.

A signal transmitting circuit may be formed in the substrate 100. The signal transmitting circuit may include a plurality of input terminals (not labeled) and a plurality of output terminals (not labeled). The output terminal may be electrically connected with the bottoms of the testing probes 101; and the first input terminals may be electrically connected with an external testing circuit. The external testing circuit may be used to provide testing signals. The signal transmitting circuit may be used to transmit the testing signals provided by the external testing circuit to the testing probes 101; and transmit the electrical signals obtained from the testing process back to the external testing circuit. The external testing circuit may process the received electrical signals; and the testing parameters may be obtained.

The substrate 100 may be made of the any appropriate material. In one embodiment, the substrate 100 is made of PCB resin.

In one embodiment, the substrate 100 may have a front surface and a facing back surface. The back surface of the substrate 100 may include interface regions. The plurality of output terminals may be disposed on the front surface of the substrate 200; and may be corresponding to the positions of the bottom surfaces of the testing probes 101. The plurality of input terminals may be integrated in the interface regions on the back surface of the substrate 100. Thus, the plurality of input terminals may be connected with the external testing circuit through one or more interfaces; and the interface circuit between the semiconductor testing fixture and the external testing circuit may be simplified.

In one embodiment, the substrate 100 may be formed by compressing a plurality of PCB boards. Each PCB board may include a plurality of interconnect structures. Each interconnect structure may include a plurality of through-board structures and metal layers formed on the surface of the PCB board and electrically connecting with the through-board structures. When the plurality of PCB boards are compressed to form the substrate 100, the plurality of interconnect structures may form a plurality of metal lines. The metal lines may be bent. Thus, the plurality of input terminals may be integrated in the interface regions on the back face of the substrate 100.

In certain other embodiments, the substrate 100 may have a front surface and a facing back surface. The back surface of the substrate 100 may include interface regions. The plurality of output terminals may be disposed on the front surface of the substrate 100. A plurality of through-board interconnect structures penetrating through the substrate 100 may be formed in the substrate 100. The plurality of input terminals and the plurality of output terminals may be electrically connected through the through-board interconnect structures.

Further, a plurality of redistribution metal layers may be formed on the back surface of the substrate 100. One end of the redistribution metal layers may be electrically connected with the input terminals; and the other end of the redistribution metal layer may be disposed in the interface regions. The redistribution metal layers may be electrically connected with the external testing circuit through one or more interfaces.

In certain other embodiments, a testing circuit (not shown) may be formed in the substrate 200. The testing circuit may include a plurality of signal terminals. The signal terminals may be electrically connected with the bottom surfaces of the testing probes 101. When the semiconductor testing fixture is used to perform a test, testing signals, such as voltage signals or current signals, etc., may be applied on the testing probes 101; and received signals, such as current signals, etc., may be processed to obtain the tested parameters, such as resistance, etc.

In one embodiment, a process for forming the plurality of testing probes 101 may include forming a metal layer (not shown) on the substrate 100; forming a patterned mask layer (not shown) on the first metal layer; etching the first metal layer using the patterned mask layer as an etching mask to form the plurality of first testing probes 101; and removing the patterned mask layer. Thus, the plurality of probes 101 may be formed on the substrate 100.

The metal layer may be made of any appropriate material, such as Cu, Au, W, or metal alloy, etc. Various processes may be used to form the metal layer, such as CVD process, a PVD process, an FCVD process, an electroplating process, or a sputtering process, etc. The metal layer may be etched by any appropriate process, such as an anisotropic dry etching process, etc.

Returning to FIG. 32, after forming the plurality of the testing probes 101, a dielectric layer may be formed (S302). FIG. 24 illustrates a corresponding structure.

As shown in FIG. 24, a dielectric layer 102 is formed on substrate 100. The dielectric layer 102 may fill the space between adjacent testing probes 101. The dielectric layer 102 may be used as a fixing layer to increase the mechanical strength of the testing probes 101; and an insulation layer to electrically insulate the adjacent testing probes 101.

In one embodiment, the dielectric layer 102 may cover the entire side surfaces of the testing probes 101. That is, the top surface of the dielectric layer 102 may level with the top surfaces of the testing probes 101.

A process for forming the dielectric layer 102 may include forming a dielectric material film covering the surfaces of the testing probes 101 on the surface of the substrate 100; and planarizing the dielectric material film using the top surfaces of the testing probes 101 as a polishing stop layer. Thus, the dielectric layer 102 may be formed.

The dielectric layer 102 may be made of any appropriate material, such as silicon oxide, silicon nitride, silicon oxynitride, silicon carbonitride, or resin (epoxy, or polyimide, etc.) etc. In one embodiment, when the dielectric material is made of one of silicon oxide, silicon nitride, silicon oxynitride, and silicon carbonitride, the dielectric material film may be formed by a CVD process. In certain other embodiments, the dielectric material layer may be made of resin material, the dielectric material film may be formed by a wet-coating process, or a screen-printing process.

Optionally and additionally, in one embodiment, as shown in FIG. 24, after forming the dielectric layer 102, a transition board 400 may be formed on the top surface of the dielectric layer 102 and the top surfaces of the testing probes 101. The transition board 400 may include an insulation layer (not labeled) formed on the top surface of the dielectric layer 102 and a plurality of metal blocks 401 formed on the top surfaces of the testing probes 101.

A process for forming the transition board 400 may include forming the insulation layer having a plurality of openings (not labeled) exposing the top surface of the testing probes 101 on the dielectric layer 102; and filling metal material in the openings to form the metal blocks 401 in the openings.

The insulation layer may be made of any appropriate material, such as silicon oxide, silicon nitride, silicon oxynitride, silicon carbonitride, or resin (epoxy, or polyimide, etc.) etc. The insulation layer having the plurality of openings may be formed by forming an insulation material layer; and etching the insulation material layer to expose the testing probes 101 to form the plurality of openings.

The size of the openings may be greater than the size of the top surfaces of the testing probes 101. Thus, the openings may expose the entire top surfaces of the testing probes 101. Accordingly, the metal blocks 401 formed in the openings may be electrically connected with the entire top surfaces of the testing probes 101.

A process for forming the metal blocks 401 may include forming a metal layer filling the openings on the insulation layer; and performing a CMP process to remove the portion of the metal layer on the surface of the insulation layer. Thus, the metal blocks 401 may be formed.

The metal layer may be made of any appropriate material, such as W, Al, Cu, Ti, Au, Pt, Ni, or metal alloy, etc. The metal layer may be formed by a sputtering process, or an electroplating process, etc.

In certain other embodiments, after forming the dielectric layer 102, the top surface of the dielectric layer 102 may be recessed. Thus, a semiconductor testing fixture illustrated in FIG. 25 may be formed. As shown in FIG. 25, the dielectric layer 102 may cover portions of the side surfaces of the testing probes 101. That is, the top surface of the dielectric layer 201 may be lower than the top surfaces of the testing probes 101. In one embodiment, the thickness of the dielectric layer 102 may be approximately ¼˜⅔ of the height of the testing probes 101. The top surface of the dielectric layer 102 may be recessed by any appropriate process, such as an etch-back process using as a dry etching process, a wet etching process, or an ion beam etching process, etc.

FIG. 33 illustrates another exemplary fabrication process of a semiconductor testing fixture. FIGS. 26˜29 illustrate structures corresponding to certain stage of the exemplary fabrication process.

As shown in FIG. 33, at the beginning of the fabrication process, a substrate with certain structures is provided (S401). FIG. 26 illustrates a corresponding structure.

As shown in FIG. 26, a substrate 100 is provided; and a dielectric layer 102 is formed on a surface the substrate 100. The dielectric layer 102 may have a plurality of through-holes 105. The number of the through-holes 105 may be greater than two.

The top view of the through-holes 105 may be circular. In certain other embodiments, the top view of the through-holes 105 may be any other appropriate shape, such as triangle, rectangle, or square, etc. The through-holes 105 may expose the surface of the substrate 100; and may be used for subsequently forming a plurality of testing probes.

A signal transmitting circuit may be formed in the substrate 100. The signal transmitting circuit may include a plurality of input terminals (not labeled) and a plurality of output terminals (not labeled). The output terminals may be electrically connected with the bottoms of the subsequently formed testing probes; and the first input terminals may be electrically connected with an external testing circuit. The external testing circuit may be used to provide testing signals. The signal transmitting circuit may be used to transmit the testing signals provided by the external testing circuit to the subsequently formed testing probes; and transmit the electrical signals obtained from the testing process back to the external testing circuit. The external testing circuit may process the received electrical signals; and the tested parameters may be obtained.

The substrate 100 may be made of the any appropriate material. In one embodiment, the substrate 100 is made of PCB resin.

In one embodiment, the substrate 100 may have a front surface and a facing back surface. The back surface of the substrate 100 may include interface regions. The plurality of output terminals may be disposed on the front surface of the substrate 200; and may be corresponding to the positions of the bottom surfaces of the subsequently formed testing probes. The plurality of input terminals may be integrated in the interface regions on the back surface of the substrate 100. Thus, the plurality of input terminals may be connected with the external testing circuit through one or more interfaces; and the interface circuit between the semiconductor testing fixture and the external testing circuit may be simplified.

In one embodiment, the substrate 100 may be formed by compressing a plurality of PCB boards. Each PCB board may include a plurality of interconnect structures. Each interconnect structure may include a plurality of through-board structures and metal layers formed on the surface of the PCB board and electrically connecting with the through-board structures. When the plurality of PCB boards are compressed to form the substrate 100, the plurality of interconnect structures may form a plurality of metal lines. The metal lines may be bent. Thus, the plurality of input terminals may be integrated in the interface regions on the back face of the substrate 100.

In certain other embodiments, the substrate 100 may have a front surface and a facing back surface. The back surface of the substrate 100 may include interface regions. The plurality of output terminals may be disposed on the front surface of the substrate 100. A plurality of through-board interconnect structures penetrating through the substrate 100 may be formed in the substrate 100. The plurality of input terminals and the plurality of output terminals may be electrically connected through the through-board interconnect structures.

Further, a plurality of redistribution metal layers may be formed on the back surface of the substrate 100. One end of the redistribution metal layers may be electrically connected with the input terminals; and the other end of the redistribution metal layers may be disposed in the interface region. The redistribution metal layers may be electrically connected with the external testing circuit through one or more interfaces.

In certain other embodiments, a testing circuit (not shown) may be formed in the substrate 100. The testing circuit may include a signal terminal. The signal terminal may be electrically connected with the bottom surfaces of the subsequently formed testing probes. When the semiconductor testing fixture is used to perform a test, testing signals, such as voltage signals or current signals, etc., may be applied on the subsequently formed testing probes; and received signals, such as current signals, etc., may be processed to obtain the testing parameters, such as resistance, etc.

The dielectric layer 102 may be made of any appropriate material, such as one or more of silicon oxide, silicon nitride, silicon oxynitride, and silicon carbonitride, etc. Various processes may be used to form the dielectric layer 102, such as a CVD process, a PVD process, or an FCVD process, etc. In one embodiment, the dielectric layer 102 is formed by a CVD process.

After forming a dielectric material layer by a CVD process, a patterned mask layer may be formed on the dielectric material layer. Then, the plurality of through-holes 105 may be formed by etching the dielectric material layer using the patterned mask layer as an etching mask to form the dielectric layer 102. After forming the dielectric layer 102 having the plurality of through-holes 105, the patterned mask layer may be removed.

The dielectric material layer may be etched by any appropriate process, such as a dry etching process, a wet etching process, or an ion beam etching process, etc. The patterned mask layer may be removed by any appropriate process, such as a dry etching process, a wet etching process, or a plasma ashing process, etc.

In certain other embodiments, the dielectric layer 102 may be made of resin material. The resin material may include epoxy, polyimide, polyethylene, benzocyclobutene, or polybenzoxazole, etc. The dielectric layer 102 made of the resin material may be formed by a dry-coating process, a wet-coating process, a screen-printing process, or a roll-coating process, etc.

After forming a dielectric film made of the resin, an exposure process and a developing process may be performed to form the plurality of through-holes 105. Thus, the dielectric layer 102 made of the resin material may be formed. By using such a process, the fabrication process of the dielectric layer 102 may be simplified.

Returning to FIG. 33, after forming the dielectric layer 102, a plurality of testing probes may be formed (S402). FIG. 27 illustrates a corresponding structure.

As shown in FIG. 27, a testing probe 101 is formed in each of the plurality of through-holes 105. The testing probes 101 may be single metal tips.

The testing probes 101 may be formed by any appropriate process, such as a CVD process, a PVD process, an FCVD process, a sputtering process, or an electroplating process, etc. In one embodiment, the testing probes 101 are formed by an electroplating process.

Before forming the testing probes 101 by an electroplating process, a conductive layer (not shown) may be formed on the side surfaces and bottoms of the through-holes 105 and the surface of the dielectric layer 102. The conductive layer may be used as a cathode for the electroplating process.

The conductive layer may be a single layer structure, or a multiple-layer structure. The conductive layer may be made of any appropriate material, such as one or more of Ti, Ta, TiN, and TiN, etc. In one embodiment, the conducive layer is a double-layer structure. The double-layer structure may be a structure having a Ti layer and a TiN layer formed on the Ti layer, or a structure having a Ta layer and a TaN layer formed on the Ta layer. The thickness of the conductive layer may be smaller than the radius of the through-holes 105.

Various processes may be used to form the conductive layer, such as a CVD process, a PVD process, or an FCVD process, etc. In one embodiment, the conductive layer is formed by a sputtering process.

After forming the conductive layer, the electroplating process may be performed to form a metal layer. The metal layer may be formed on the conductive layer and may fill the through-holes 105. After the electroplating process, a CMP process may be performed to remove portions of the conductive layer and the metal layer on the surface of the dielectric layer 102. Thus, the testing probes 101 may be formed. The testing probes 101 may include portions of the conductive layer and the portions of the metal layer covered by the portions of the conductive layer. The portions of the conductive layer may be used as a diffusion barrier layer to prevent the metal in the metal layer from diffusing into the dielectric layer 102. The metal layer may be made of any appropriate material, such as Cu, Au, W, or metal alloy, etc.

In one embodiment, the testing probes 101 are formed by the electroplating process. Thus, the testing probes may not be damaged by an etching process. Therefore, the morphology of the testing probes 101 may be as desired.

Optionally and additionally, in one embodiment, as shown in FIG. 28, after forming the plurality of testing probes 101, a transition board 400 may be formed on the top surface of the dielectric layer 102 and the top surfaces of the testing probes 101. The transition board 400 may include an insulation layer (not labeled) formed on the top surface the dielectric layer 102 and a plurality of metal blocks 401 formed on the top surfaces of the testing probes 101.

A process for forming the transition board 400 may include forming the insulation layer having a plurality of openings (not labeled) exposing the top surfaces of the testing probes 101 on the dielectric layer 102; and filling metal material in the openings to form the metal blocks 401 in the openings.

The insulation layer may be made of any appropriate material, such as silicon oxide, silicon nitride, silicon oxynitride, silicon carbonitride, or resin (epoxy, or polyimide, etc.) etc. The insulation layer having the plurality of openings may be formed by forming an insulation material layer; and etching the insulation material layer to expose the testing probes 101 to form the plurality of openings.

The size of the openings may be greater than the size of the top surfaces of the testing probes 101. Thus, the openings may expose the entire top surfaces of the testing probes 101. Accordingly, the metal blocks 401 formed in the openings may be electrically connected with the entire top surfaces of the testing probes 101.

A process for forming the metal blocks 401 may include forming a metal layer filling the openings on the insulation layer; and performing a CMP process to remove the portion of the metal layer on the surface of the insulation layer. Thus, the metal blocks 401 may be formed.

The metal layer may be made of any appropriate material, such as W, Al, Cu, Ti, Au, Pt, Ni, or metal alloy, etc. The metal layer may be formed by a sputtering process, or an electroplating process, etc.

In certain other embodiments, after forming the testing probes 101, the top surface of the dielectric layer 102 may be recessed. Thus, a semiconductor testing fixture illustrated in FIG. 29 may be formed. As shown in FIG. 29, the dielectric layer 102 may cover portions of the side surfaces of the testing probes 101. That is, the top surface of the dielectric layer 102 may be lower than the top surfaces of the testing probes 101. In one embodiment, the thickness of the dielectric layer 102 may be approximately ¼˜⅔ of the height of the testing probes 101. The top surface of the dielectric layer 102 may be recessed by any appropriate process, such as an etch-back process using as a dry etching process, a wet etching process, or an ion beam etching process, etc.

According to the disclosed methods and structures, the first testing tip and the second testing tip may be integrated in one testing probe. The second testing tip may surround the first testing tip; and the second testing tip and the first testing tip may be insulated by an insulation layer. Thus, the mechanical strength of the testing probe may be improved when the size of the testing probe is substantially small.

Further, because the first testing tip and the second testing tip may be coaxially distributed, the distance accuracy between the first testing tip and the second testing tip may be significantly high. Thus, the testing accuracy may be improved.

Further, the first testing tip and the second testing tip may be integrated into a single testing probe. Thus, a single testing probe may be used as stand-alone to perform an electrical testing.

Further, a dielectric layer may be formed on the substrate. The dielectric layer may be able to electrically insulate adjacent testing probes; and increase the mechanical strength of the testing probes.

Further, a transition board may be formed on the top surface of dielectric layer and the top surfaces of the testing probes. The transition board may be used as a transitional structure between the testing probes and the tested terminals of a packaging structure. Thus, the transition board may make an electrical testing to be convenient. Further, the transition board may cause the testing probes and the tested terminals to have an indirect contact. Thus, the damages to the tested terminals, and/or the deformation of the testing probes caused by a direct contact between the testing probes and the testing probes may be prevented.

The above detailed descriptions only illustrate certain exemplary embodiments of the present invention, and are not intended to limit the scope of the present invention. Those skilled in the art can understand the specification as whole and technical features in the various embodiments can be combined into other embodiments understandable to those persons of ordinary skill in the art. Any equivalent or modification thereof, without departing from the spirit and principle of the present invention, falls within the true scope of the present invention. 

What is claimed is:
 1. A semiconductor testing fixture, comprising: a substrate having a surface; a plurality of testing probes formed on the surface of the substrate; and a dielectric layer filling space between adjacent testing probes and covering side surfaces of the plurality of the testing probes formed on the surface of the substrate.
 2. The semiconductor testing fixture according to claim 1, wherein each of the plurality of testing probes comprises: a first testing tip; an insulation layer formed on a side surface of the first testing tip; and a second testing tip being coaxial with the first testing tip and surrounding the first testing tip formed on side surface of the insulation layer.
 3. The semiconductor testing fixture according to claim 2, wherein the substrate further comprises: a signal transmitting circuit including a plurality of first output terminals electrically connected with the first testing tips, a plurality of second output terminals electrically connected with the second testing tips, and a plurality of first input terminals and a plurality of second input terminals electrically connected with an external testing circuit.
 4. The semiconductor testing fixture according to claim 1, wherein each of the plurality of testing probes comprises: a single metal tip.
 5. The semiconductor testing fixture according to claim 4, wherein the substrate further comprises: a signal transmitting circuit having a plurality of output terminals electrically connected with the testing probes, and a plurality of input terminals electrically connected with an external testing circuit.
 6. The semiconductor testing fixture according to claim 1, wherein: the dielectric layer covers portions of side surfaces of the plurality of testing probes.
 7. The semiconductor testing fixture according to claim 6, wherein: a thickness of the dielectric layer is approximately ¼˜⅔ of a height of the testing probes.
 8. The semiconductor testing structure according to claim 1, wherein the dielectric layer covers entire side surfaces of the plurality of testing probes.
 9. The semiconductor testing fixture according to claim 8, further comprising: a transition board formed on a top surface of the dielectric layer and top surfaces of the plurality of testing probes.
 10. A method for fabricating a semiconductor testing fixture, comprising: providing a substrate having a surface; forming a plurality of testing probes on the surface of the substrate; and forming a dielectric layer electrically insulating adjacent testing on the surface of the substrate.
 11. The method according to claim 10, wherein: the dielectric layer covers entire side surfaces of the testing probes.
 12. The method according to claim 11, further comprising: forming a transition board on a top surface of the dielectric layer and top surfaces of the testing probes.
 13. The method according to claim 11, further comprising: recessing a top surface of the dielectric layer to cause a top surface of the dielectric layer to be lower than top surfaces of the testing probes.
 14. The method according to claim 10, wherein each of the plurality of testing probes comprises a first testing tip; an insulation layer formed on a side surface of the first testing tip; and a second testing tip being coaxial with the first testing tip and surrounding the first testing tip formed on side surface of the insulation layer.
 15. The method according to claim 14, wherein forming the plurality of testing probes further comprises: forming a plurality of the first testing tips on the surface of the substrate; forming the insulation layer on side surfaces of the first testing tips; and forming the second testing tip on the insulation layer around each of the plurality of first testing tips.
 16. A method for fabricating a semiconductor testing fixture, comprising: providing a substrate having a surface; forming a dielectric layer on the surface of the substrate; and forming a plurality of testing probes in the dielectric layer by the dielectric layer in the dielectric layer.
 17. The method according to claim 16, wherein: each of the plurality of testing probes comprises a first testing tip; an insulation layer formed on a side surface of the first testing tip; and a second testing tip being coaxial with the first testing tip and surrounding the first testing tip formed on side surface of the insulation layer.
 18. The method according to claim 17, wherein forming the plurality of testing probes further comprises: forming a plurality of first through-holes and a plurality of ring-shaped through-holes being coaxial with the first through-holes and surrounding the first through-holes in the dielectric layer; and forming a first testing tip in each of the plurality of first through-holes and a second testing tip in each of the plurality of ring-shaped through-holes.
 19. The method according to claim 16, after forming the plurality of testing probes further including: forming a transition board on a top surface of the dielectric layer and top surfaces of the plurality of testing probes when the dielectric layer covers entire side surfaces of the testing probes.
 20. The method according to claim 16, after forming the plurality of the testing probes further comprising: recessing the dielectric layer to cause a top surface of the dielectric layer to be lower than top surfaces of the plurality of testing probes. 